Wafer Blade Sawing Solution Surface Active Agent Products : Hyper-Pro ® Selecting the Best Material - Reduce Surface Tension(31dynes/cm) and ESD effect control - Coating Shields formed upon the Wafer Surface - Prevent Particles from Surface deposition - Blade Wafer sawing Quality control from Die Chipping, Burr and crack - Reduce Temperature of Blade by lubrication, cutting and cooling that prevent static electricity (Improve Blade Life time extend) - Non-ionic surface active agent : PH (6.5-8.5) - Environmental Standard Optimized : COD, BOD, ROHS - An exclusive Wafer Sawing Chemical for specialized Corrosion and Galvanic Cell