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MICRONOX® MX2322
SEMICONDUCTOR & ADVANCED PACKAGING CLEANING CHEMISTRY
MICRONOX MX2322 is a semiconductor grade semi-aqueous solvent that is designed to clean all types of paste fluxes common in wafer bumping, wafer-level packaging, die-attach, flipchip and SiP containing copper pillar. MICRONOX MX2322 demonstrates its excellent cleaning performance and benefits in single-wafer spray-in-air tools as well as all immersion cleaning systems.
MICRONOX MX2322 is a semiconductor grade semi-aqueous solvent that is designed to clean all types of paste fluxes common in wafer bumping, wafer-level packaging, die-attach, flipchip and SiP containing copper pillar. MICRONOX MX2322 demonstrates its excellent cleaning performance and benefits in single-wafer spray-in-air tools as well as all immersion cleaning systems.
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