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DS MERLIN WAFER-TO-WAFER / WAFER-TO-PANEL
High speed wafer-to-wafer / wafer-to-panel
With the new DS MERLIN, Mühlbauer was able to achieve a new record throughput of more than 40,000 UPH – already including full vision and sidewall inspection. On top of the significantly increased speed, the DS MERLIN shows 50% lower cost of ownership compared to other wafer-to-wafer solutions. The completely new construction method of the DS MERLIN’s core module features a special die ejector and a pick & place wheel instead of the conventional bonding technology. The machine and product setup have also been significantly simplified
With the new DS MERLIN, Mühlbauer was able to achieve a new record throughput of more than 40,000 UPH – already including full vision and sidewall inspection. On top of the significantly increased speed, the DS MERLIN shows 50% lower cost of ownership compared to other wafer-to-wafer solutions. The completely new construction method of the DS MERLIN’s core module features a special die ejector and a pick & place wheel instead of the conventional bonding technology. The machine and product setup have also been significantly simplified
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