Application:
- Keeps mold tool clean from substances such as silicone or epoxy
- Can be used over 200℃ high temperature
- Superior release performance without resin in cavity
- Adaptable to matt type for semiconductor packing or glossy type for LED manufacturing
- Can be modified according to a customer’s individual requirements (Thickness, Matte etc.)
* Compression Mold Diagram
RELEASE FILM
Product Description / Properties:
- Excellent release properties, combined with high elongation
- Excellent mechanical stability at high temperatures
- MNR-E50-GY-L / High elongation film for LED package (over 700% in 175℃)
- High-tear –and tear propagation strength
- Excellent release behavior
- Excellent antiadhesivity
- Suitable for all commonly used resin system
Application:
- Manufacturing in the semiconductor industry
Anti-Static Mold Release Film(EDS Process)
Product Description / Properties:
- To give Anti-Static property maintaining the release properties from existing mold release film
- Compose of electro-conductivity material of thin fit between film layer
- Electro-conductive material gets electricity flow improved and block static electricity
Properties:
- Semi-permanent maintenance of anti-static function
- Maintaining its anti-static function at high temperature process
Product Structure
* Exposed Die FCCSP Diagram
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