CYBERSOLV C8622 improves stencil printing yields by removing trace solder paste deposits from the stencil aperture. C8622 is safe and effective in all IPA applications, boasting extensive compatibility and low odor. CYBERSOLV C8622 dries spot free and does not require a rinsing step, however, if needed, use fresh C8622 or Hot DI Water.
NOTE: The above process parameters are recommendations based on extensive testing done in KYZEN’s application lab. Your KYZEN sales representative can assist you in optimizing your process parameters.